HP | HPQ - Zinsaufwendungen Für Schuld





Zinsaufwendungen Für Schuld Veränderung Datum
3D Systems 1.96M 36K 2025-12
Accenture USD 70.64M 7.08M 2026-03
Advanced Micro Devices USD 37M 1000K 2026-03
Amphenol USD 207.9M 78.2M 2026-03
Apple USD 377M 98M 2025-09
Applied Materials USD 69M 0 2026-03
Arista Networks USD 85M 43.2M 2024-09
Broadcom USD 807M 49M 2026-03
Canon JPY 2.29B 263M 2025-12
CDW USD 58.5M 3.5M 2025-12
Ciena USD 20.92M 332K 2026-03
Cisco Systems USD 370M 20M 2025-12
CommScope USD 153.1M 17.8M 2025-12
Corning USD 92M 1000K 2026-03
F5 Networks USD 6.5B 205.79M 2026-03
Hewlett Packard USD 101M 24M 2025-12
HP USD 99M 2M 2025-12
IBM USD 473M 5M 2026-03
Intel USD 283M 1000K 2025-12
Jabil Circuit USD 63M 5M 2025-09
KLA Corporation USD 70.42M 755K 2026-03
Lam Research USD 40.88M 1.59M 2025-12
Lenovo USD 158.63M 84M 2025-12
Micron Technology USD 32M 42M 2025-12
Microsoft USD 778M 42M 2026-03
Motorola Solutions Msi USD 117M 14M 2025-12
NCR USD 16M 1000K 2025-12
NetApp USD 21M 9M 2025-03
Nvidia USD 102M 29M 2026-03
Oracle USD 1.18B 123M 2025-12
Qualcomm USD 171M 2M 2026-03
Ricoh JPY 1.93B 841M 2025-06
Sanmina USD 32.14M 26.95M 2026-03
Seagate Technology USD 68M 4M 2026-03
Seiko Epson JPY 2.58B 3.94B 2025-06
Sensata Technologies USD 35.7M 2.02M 2025-12
Stratasys 726K 1.58M 2024-06
SYNNEX USD 97.84M 9.84M 2026-03
TE Connectivity USD 32M 2M 2026-03
Western Digital USD 54M 5M 2025-12
Xerox USD 31M 0 2024-12