Corning | GLW - Zinsaufwendungen Für Schuld





Zinsaufwendungen Für Schuld Veränderung Datum
ADTRAN USD 4.52M 979K 2025-12
AGC JPY 4.27B 645M 2026-03
Amphenol USD 207.9M 78.2M 2026-03
Apple USD 377M 98M 2025-09
Applied Materials USD 69M 0 2026-03
Arista Networks USD 85M 43.2M 2024-09
Ciena USD 20.92M 332K 2026-03
Cisco Systems USD 370M 20M 2025-12
Clearfield USD 106K 37K 2025-06
Coherent USD 44.56M 1.34M 2026-03
CommScope USD 153.1M 17.8M 2025-12
Corning USD 92M 1000K 2026-03
F5 Networks USD 6.5B 205.79M 2026-03
Harmonic USD 1.08M 682K 2026-03
Hewlett Packard USD 101M 24M 2025-12
HP USD 99M 2M 2025-12
IBM USD 473M 5M 2026-03
Jabil Circuit USD 63M 5M 2025-09
Keysight Technologies USD 25M 4M 2026-03
KLA Corporation USD 70.42M 755K 2026-03
Lam Research USD 40.88M 1.59M 2025-12
Micron Technology USD 32M 42M 2025-12
Motorola Solutions Msi USD 117M 14M 2025-12
NetApp USD 21M 9M 2025-03
NGK Insulators JPY 850M 61M 2025-12
Nippon Electric Glass JPY 316M 13M 2025-06
PPG Industries USD 58M 7M 2025-12
Prysmian EUR 141M 96M 2025-12
Qualcomm USD 171M 2M 2026-03
Revvity USD 24.72M 1.2M 2026-03
Seagate Technology USD 68M 4M 2026-03
Sensata Technologies USD 35.7M 2.02M 2025-12
Stratasys 726K 1.58M 2024-06
TE Connectivity USD 32M 2M 2026-03
Thermo Fisher Scientific USD 354M 11M 2026-03
Universal Display USD 9.44M 607K 2025-12
Western Digital USD 54M 5M 2025-12
Xerox USD 31M 0 2024-12