Taiwan Semiconductor | 2330 - Zinsaufwendungen Für Schuld





Zinsaufwendungen Für Schuld Veränderung Datum
Advanced Micro Devices USD 37M 1000K 2026-03
Applied Materials USD 69M 0 2026-03
ASML Holding EUR 6.3M 5.11M 2024-12
Catcher Technology TWD 295.07M 16.56M 2025-12
Hou Hai Precision TWD 8.71B 17.76M 2025-09
Intel USD 264M 19M 2026-03
Jentech Precision TWD 382K 7.32M 2026-03
Lam Research USD 39.33M 1.54M 2026-03
Largan Precision TWD 594K 194K 2026-03
Lenovo USD 158.63M 84M 2025-12
Mediatek TWD 101.22M 49.22M 2026-06
Micron Technology USD 32M 42M 2025-12
Nvidia USD 102M 29M 2026-03
Qualcomm USD 178M 7M 2026-06
Seagate Technology USD 68M 4M 2026-03
Semiconductor Manufacturing International USD 108.63M 11.31M 2025-12
Shenzhen Goodix Technology CNY 160K 2.17M 2025-09
Silicon Motion Technology USD 3.52M 657K 2024-09
Taiwan Semiconductor TWD 3.04B 647.64M 2025-12
Tsec TWD 18.02M 220K 2024-06
Western Digital USD 54M 5M 2025-12